Question
Explain the difference between chemical vapour deposition and physical vapour deposition. What are the requirements of a material to be used as a holder for the charge in a thermal evaporation system? Mention any three materials used for the purpose.
Answer :
Word Count : 240
Chemical Vapour Deposition (CVD) and Physical Vapour Deposition (PVD) are two distinct thin film deposition techniques used in materials science. In CVD, a chemical reaction occurs between gaseous reactants on the substrate surface, leading to the formation of a solid film. The process typically requires high temperatures and results in films with excellent conformity and uniformity, even on complex surfaces. __________ _____ ________ _____ _________ ____ _____.
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Chemical Vapour Deposition (CVD) and Physical Vapour Deposition (PVD) are two distinct thin film deposition techniques used in materials science. In CVD, a chemical reaction occurs between gaseous reactants on the substrate surface, leading to the formation of a solid film. The process typically requires high temperatures and results in films with excellent conformity and uniformity, even on complex surfaces. __________ _____ ________ _____ _________ ____ _____.
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